Merit Based Scholarships – Scholarships awarded based upon academic merit only (Check box on application if you wish only this consideration)
Merit & Financial Need – Scholarships awarded based upon academic merit and financial need. Students wishing to receive consideration for those scholarships are required to file the 2008/2009 Free Application for Federal Student Aid (FAFSA) form. This application form may be filed on line at www.fafsa.ed.gov.
2. Minimum Qualifications
Applicants must have at least an 80% high school average unless stated otherwise within the scholarship listing.
Applicants must be matriculated, filed for admission by June 1, and plan on enrolling full-time in an Associate Degree or Certificate Program in the Fall of 2008 unless otherwise stated within the scholarship listing.
3. Application Procedures
File Admission Application
Complete the attached Entering Freshman Scholarship Application
Submit two letters of recommendations in support of your application
File on-line 2008/2009 Free Application for Federal Student Aid (FAFSA) unless seeking “merit scholarship consideration only”
List of extracurricular high school and community services activities with dates and any other
outside obligations such as family and work demands
Submit an academic transcript
Submit a 250 word typewritten essay
4. Acknowledgement Procedures
Applicants are responsible to ensure that all materials submitted are complete
An e-mail acknowledgement on receipt of completed applications will be made for students providing e-mail addresses. Students without e-mal addresses will be notified by mail
5. Major Criteria Used to Award Scholarships
Academic ability
Two recommendations from high school Faculty/Guidance Counselor (Returning adults may provide other recommendations)
Demonstrated financial need where applicable
Involvement in extracurricular and community service activities, family and work demands
Academic Transcript indicating 80% or higher average
Quality of typewritten essay
6. Deadlines
Submission of All Application Materials – May 1, 2008